this is information on a product in full production. march 2014 docid023702 rev 2 1/9 ESDAXLC6-1BU2 single-line bidirectional esd protection for high speed interface datasheet - production data figure 1. functional diagram (top view) features ? bidirectional device ? extra low diode capacitance: 0.4 pf ? low leakage current ? 0201 smd package size compatible ? ultra small pcb area: 0.18 mm 2 ? ecopack ? 2 and rohs compliant component complies with the following standards: ? iec 61000-4-2 level 4 ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required, such as: ? smartphones, mobile phone and accessories ? tablet pcs, netbooks and notebooks ? portable multimedia devices and accessories ? digital cameras and camcorders ? communication and highly integrated systems description the ESDAXLC6-1BU2 is a bidirectional single line tvs diode designed to protect the data lines or other i/o ports against esd transients. the device is ideal for applications where both reduced line capacitance and board space saving are required. 0201 package pin 1 available in different forms pin1 www.st.com
characteristics ESDAXLC6-1BU2 2/9 docid023702 rev 2 1 characteristics note: for a surge greater than the maximum values, the diode will fail in short-circuit figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec 61000-4-2 contact discharge iec 61000-4-2 air discharge 16 25 kv p pp peak pulse power (8/20 s) 40 w i pp peak pulse current (8/20 s) 1.3 a t j operating junction temperature range - 40 to +150 c t stg storage temperature range - 65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current c = parasite capacitance r br rm rm rm pp d = dynamic impedance t = voltage temperature coefficient table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v 70 na v cl i pp = 1 a, 8/20 a 17 v c line f = (200 mhz- 3000 mhz), v r = 0 v 0.4 0.5 pf
docid023702 rev 2 3/9 ESDAXLC6-1BU2 characteristics 9 figure 7. attenuation measurement results figure 3. leakage current versus junction temperature (typical values) figure 4. junction capacitance versus applied voltage (typical values) 0.01 0.10 1.00 10.00 25 35 45 55 65 75 85 95 105 115 125 135 145 i r (na) t j (c) v r = 3 v direct/reverse 0.0 0.2 0.4 0.6 0.8 1.0 012345 c v r (v) (pf) v osc = 30 mv rms t j = 25 c direct / reverse figure 5. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 6. esd response to iec 61000-4-2 (-8 kv contact discharge) 50 v/div v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 158 v 1 42 v 2 2 29 v 3 15 v 4 20 ns/div 50 v/div -14 v 4 -31 v -41 v 3 2 v : peak clamping voltage cl v :clamping voltage at 30 ns cl v :clamping voltage at 60 ns cl v :clamping voltage at 100 ns cl 1 2 3 4 -163 v 1 20 ns/div 10.0m 100.0m 1.0g 10.0g 100.0g -6.00 -5.00 -4.00 -3.00 -2.00 -1.00 0.00 ESDAXLC6-1BU2 s21(db) f(hz)
package information ESDAXLC6-1BU2 4/9 docid023702 rev 2 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. 0201 di mension definitions table 3. 0201 package dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.23 0.28 0.33 0.0091 0.0110 0.0130 b1 0.20 0.25 0.30 0.0079 0.0098 0.0118 b2 0.20 0.25 0.30 0.0079 0.0098 0.0118 d 0.25 0.30 0.35 0.0099 0.0118 0.0138 e 0.55 0.60 0.65 0.0217 0.0236 0.0256 e 0.35 0.0138 l1 0.13 0.18 0.23 0.0052 0.0071 0.0091 l2 0.14 0.19 0.24 0.0055 0.0075 0.0095 e d a l1 l1 l2 l2 e e b2 b2 b1 b1 to p side bottom pin 1 available in different forms pin 1 bottom
docid023702 rev 2 5/9 ESDAXLC6-1BU2 package information 9 note: product marking may be rotated by 180 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 11. tape and reel specifications figure 9. footprint dimensions in mm (inches) figure 10. marking 0.243 (0.0096) 0.170 (0.0067) 0.300 (0.0118) 0.243 (0.0096) 0.656 (0.0258) pin2 pin 1 z2 bar indicates pin 1 user direction of unreeling all dimensions in mm 4.0 2.0 8.0 2.0 1.75 3.5 ? 1.55 0.34 0.38 0.22 0.67 z2 z2 z2 z2 z2 z2 z2
recommendation on pcb assembly ESDAXLC6-1BU2 6/9 docid023702 rev 2 3 recommendation on pcb assembly 3.1 stencil opening design figure 12. recommended stencil windows position 3.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 0.230 (0.0091) 0.183 (0.0072) 0.170 (0.0067) 0.300 (0.0118) 0.285 (0.0112) 0.656 (0.0258) 0.643 (0.0253) footprint stencil window 0.007 (0.00027) 0.007 (0.00027) 0.008 (0.0003) 0.008 (0.0003) mm (inches) 0.243 (0.0096)
docid023702 rev 2 7/9 ESDAXLC6-1BU2 recommendation on pcb assembly 9 3.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 3.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 3.5 reflow profile figure 13. st ecopack ? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. maximum soldering profile corresponds to the latest ipc/jedec j-std-020. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 - 6c/s 240-245 c 2 - 3 c/s temperature (c) -2 c/s -3 c/s time (s) 0.9 c/s 60 sec (90 max)
ordering information ESDAXLC6-1BU2 8/9 docid023702 rev 2 4 ordering information figure 14. ordering information scheme 5 revision history table 4. ordering information order code marking weight base qty delivery mode ESDAXLC6-1BU2 z2 (1) 1. the marking can be rotated by 180 to differentiate assembly location 0.124 mg 15000 tape and reel esda xlc 6 - 1b u2 esda array extra low capacitance package u2 = st0201 breakdown voltage direction 6 = 6 v min b = bidirectional table 5. document revision history date revision changes 21-sep-2012 1 initial release. 27-mar-2014 2 updated figure 5 , figure 6 , figure 7 , figure 9 and figure 13 . updated package graphics.
docid023702 rev 2 9/9 ESDAXLC6-1BU2 9 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com
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